[2012]
Adhesion Enhancement of Ink-Jet Printed Conductive Copper Patterns on a Flexible Substrate
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2018.07.11 16:41
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저널명 : Journal of Materials Chemistry, 22 (2012), p12517-22
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- 관련링크 : http://dx.doi.org/10.1039/C2JM31381B1310회 연결
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