Thermal Related Materials
Heat dissipation has emerged as a serious issue for the performance and long-term stability of micro-electronics and battery packaging. The materials composed of heat dissipation materials should meed excellent thermal conducting property, as well as electrical insulation property. Polymer based composite has been in the spotlight due to easy processing, moderate cost. Such a polymer based materials can be apply in aerospace, sensor..
In order to maximizing properties of composite, designing filler in the matrix is the important factor. We `ve been designed the state-of-art composites by the use of minimum amount of filler
BN / polymer composite
Hexagonal Boron nitride (BN) fragments posesses excellent thermal property with electrical insulation. Such tremendeous properties could be maximized and versatilized by mixing with polymer. We have focused on the fabrication of BN based polymer composite using BN coated polymer beads in order to maximize percolation networks.
Carbon nanotube / polymer composite
Carbon nanotube (CNT) posesses excellent thermal property with electrical conductivity. Such properties advantages make CNT based polymer composite with excellent electrically and thermally conductive property. We have focused on the fabrication of the excellent property CNT / PMMA composite. Furthermore, optimization of composite fabrication is accomplishing by the accessibility of theoretical study of percolation
Graphene / polymer composite
Graphene posesses excellent thermal property with electrical conductivity. Such properties advantages make Graphene based polymer composite with excellent electrically and thermally conductive property. We have focused on the fabrication of state-of-art graphene based composite with the use of trace dose of graphene
